Technology

Coating Technology

Plating Technology

Photo Process Technology

 

+ Coating Technology

   

 

Based on vacuum technologies of e-beam evaporation, thermal evaporation and sputtering deposition, we provide good quality thin film on various substrates such as alumina substrate, glass substarte, polymer film, and so on.

Our sputtering system has ION BEAM SOURCE, which is developped for adhesion enhancement by ourselves, so we can provide more adhesive film than commercial technology.

+ Plating Technology

 

OTF Technology has various solutions for plating such as very sensitive DC Plating and Pulse Reverse Plating. And also we use unique chemical solution which we make up with our own chemical recipe.

We are very expertized in technology for non conductive materials - i.e. ceramic, glass, plastic and so on.

Especially for ceramic through hole via plating, we can provide high aspect ratio(0.5 = diameter/substate thickness) via connection.

as an example - diameter 125 um for 250 um thick ceramic

+ Photo Technology

We have a lots of solutions in the field of thin PR, thick PR, BM PR and DFR for dry process and wet process.

We can provide high aspect ratio photolithography for copper electroplating and also soft gold plating with negative PR.

For gold pattern plating, we can grow the gold with thickness of 5 microns using Negative PR.

   

 

COMPANY

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History

Map

 

PRODUCTS

Thin Film Substrate

Ceramic PCB

 

FOUNDRY

Metal Coating

Patterning

Plating

Etching

 

TECHNOLOGY

Metallization

Plating

Etching

 

SUPPORT

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