Coating Service

Metal

Dielectric

Multi Layer

 

Wet Process

Electro Plating

Electroless Plating

Chemical Etching

 

Photo Process

Photo Material Coating

Developping

Stripping

 

Sol-Gel Process

Sol-Gel Coating

 

R&D Service

R&D and Cowork

 

 

Wet Process

We provide Thin Film Coating Service to our customer using sputtering system, evaporation system with high quality and quick response. And also we can support our customer providing various samples from R&D size sample to large size(upto 1,000mm x 500mm).

   

+ Electro Plating

 

Soft Gold Plating for Gold Wire Bondging & Eutectic Die Bonding

Plating Material Layer: Au

Au thickness: 0.5 ~ 5 um

 

Complex Plating for Gold Wire Bondging & Eutectic Die Bonding

Plating Material Layer: Cu/Ni/Au

Cu thickness: 0.5 ~ 5 um

Ni thickness: 2 ~ 4 um

Au thickness: 0.5 ~ 5 um

+ Electroless Plating

 

Au Plating for Gold Wire Bondging

Plating Material Layer: Ni, Au, Ni/Au

Ni thickness: 2 ~ 4 um

Au thickness: 0.03 ~ 0.05 um

+ Chemical Etching

 

Etching Material: Ti, Cu, Au

   

 

COMPANY

Greeting

History

Map

 

PRODUCTS

Thin Film Substrate

Ceramic PCB

 

FOUNDRY

Metal Coating

Patterning

Plating

Etching

 

TECHNOLOGY

Metallization

Plating

Etching

 

SUPPORT

Contact